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Technology Capability(hard board)

Type Dongguann Jiangxi
Scope Double Side、Multilayers(4-20)、HDI(4-18)metal Multilayers(4-28)、HDI(4-20)Flex、Rigid Flex
Double Side CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm) CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)
Multilayers 4-20 layers, board thickness 15mil-126mil (0.38mm-3.2mm) 4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)
Buried/Blind Via 4-18 layers, board thickness 15mil-126mil(0.38mm-3.2mm) 4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)
HDI 1+N+1,1+1+N+1+1, LDPor RCC 1+N+1,2+N+2,3+N+3,LDP or RCC
Metallic Base PCB Aluminium Based, Copper Based PCB
Flex & Rigid-Flex PCB N.A. 1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB
Laminate Shengyi 、Kingboard & etc.
Soldermask Type(LPI) Taiyo、Goo’s、Probimer Taiyo、Goo’s、Probimer FPCsoldermask
Peelable Soldermask Peters
Carbon ink Nipon
HASL/Lead Free HASL Thickness: 40 to 1,600 u in (1 - 40 um) N/A
OSP Entek Plus HT, Preflux F2 LX
ENIG (Ni-Au) Au:2to4uin(0.05~0.10um) Ni:120~250uin(3.00~6.25um)
Electro-bondable Ni-Au Au:min.12uin(0.3um) Ni:120~600uin(3~15um)
Electro. Hard Gold Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
Immersion Tin ATO:min.40uin(1.0um);Ormecon Nano:12~20uin(0.3~0.5um)
Capability Mass Production Mass Production
Min Mechanical Drill Hole 8mil(0.20mm) 8mil(0.20mm)
Min. Laser Drill Hole 5mil (0.125mm) 4mil (0.100mm)
Line Width/Spacing 3mil/3mil 3mil/3mil
Max. Panel Size 18.5" X 24.5"(470mm X 622mm) 21.5" X 24.5"(546mm X 622mm)
Line Width/Spacing Tolerance +/-10% ~ +/-20% +/-10% ~ +/-20%
PTH Hole Tolerance +/-0.003inch(0.075mm) +/-0.002inch(0.050mm)
NPTH Hole Tolerance +/-0.002inch(0.050mm) +/-0.002inch(0.050mm)
Hole Location Tolerance +/-0.003inch(0.075mm) +/-0.002inch(0.050mm)
Hole to Edge Tolerance +/-0.004inch(0.100mm) +/-0.004inch(0.100mm)
Edge to Edge Tolerance +/-0.004inch(0.100mm) +/-0.004inch(0.100mm)
Layer to Layer Tolerance +/-0.004inch(0.100mm) +/-0.003inch(0.075mm)
Impedance Tolerance +/- 10% +/- 8%
Warpage % Max ≤0.75% Max≤0.5%

Technology (HDI Product)

ITEM Production Tighten Control
Laser Via Drill/Pad 0.125/0.30 、 0.125/0.38 0.125/0.28 、 0.125/0.36 、 0.20/0.40
Blind Via Drill/Pad 0.25/0.50 0.20/0.45
Line Width/Spacing 0.10/0.10 0.075/0.075
Hole Formation CO2 Laser Direct Drill
Build Up Material FR4 LDP(LDD); RCC 50 ~100 micron
Cu Thickness on Hole Wall Blind Hole: 10um(min) Buried Hole: 13um(min)
Aspect Ratio 0.8 : 1

Technology (Flexible PCB)

Classification PI Thk.(um) Adhesive Thk.(um) ED Cu Thk.(um) RA Cu Thk.(um)
Single Side 2-Layer FCCL 12.5;25;50 NA 12;18;35 18;35
Double Side 2-Layer FCCL 12.5;25;50 NA 12;18;35 18;35
Single Side 3-Layer FCCL 12.5;25;50 12;20 18;35 18;35
Double Side 3-Layer FCCL 12.5;25;50 12;20 18;35 18;35
Coverlay 12.5;25 15;25;30 NA NA
Bonding film Bonding Material NA 12.5;25;35; NA NA
PP Bonding Material NA 40;75 NA NA

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ICP  1107119