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产品技术
产品范围
| 双面 |
CEM-3, FR-4, Rogers RO4233, 和Bergquist 耐热性覆铜箔板
8mil – 120 mil (0.2mm - 3.0mm) |
| 多层 |
4 - 16 层、板厚15mil - 120mil (0.38mm - 3.0mm) |
| 盲埋孔 |
4 - 12 层、板厚15mil - 62mil (0.38mm - 1.6mm) |
| HDI |
1+N+1, 1+1+N+1+1, 2+N+2. RCC 或者LDP |
| 主要板材 |
Shengyi & Kingboard |
| 环保产品 |
用于双面, 多层，HDI (RoHS, Halogen-Free无卤素) |
表面处理
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液态感光性绿油(LPI) : Taiyo, Goo’s, Probimer
- 可剥离性绿油: Peters
- 导电性碳油: Asahi
- 热风整平(HASL), 锡厚40 to 1,000 μ in (1 - 25 μm)
- 抗氧化处理(OSP): Entek Plus HT, Preflux F2 LX
- 无电解镀金: 2 to 5 μ in (0.05 ~ 0.125 μm); Ni: 120 ~ 250 μ in (3.00~6.25 μm)
- 电镀邦定型Ni-金、厚度Au: 最小12 μ in ( 0.3 μm); Ni:120 ~ 600 μ in (3 ~ 15 μm)
- 镀金手指Au厚: 5 ~ 30 μ in (0.125 ~ 0.750 μm); Ni厚:100 ~ 250 μ in (2.50~6.25μm )
- 沉锡厚:最小40 μ in (1.0 μm)
| 能力 |
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通常 |
改进 |
| 最小机械钻孔孔径 |
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16mil (0.400mm) |
8mil (0.200mm) |
| 最小镭射钻孔孔径 |
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5mil (0.125mm) |
4mil (0.100mm) |
| 线宽/线距 |
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5mil (0.125mm) |
3mil (0.075mm) |
| 最大生产板尺寸 |
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21.5” x 24.5” (546mm x 622mm) |
| 项目 |
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通常 |
改进 |
| 线宽/线距 |
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+/-20% |
+/-10% |
| 沉铜孔径 |
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+/-0.003 inch (0.075mm) |
+/-0.002 inch (0.050mm) |
| 非沉铜孔径 |
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+/-0.002 inch (0.050mm) |
+/-0.002 inch (0.050mm) |
| 孔位精度 |
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+/-0.003 inch (0.075mm) |
+/-0.002 inch (0.050mm) |
| 孔到边精度 |
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+/-0.005 inch (0.125mm) |
+/-0.004 inch (0.100mm) |
| 边到边精度 |
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+/-0.006 inch (0.150mm) |
+/-0.005 inch (0.125mm) |
| 层到层对位精度 |
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+/-0.005 inch (0.125mm) |
+/-0.005 inch (0.125mm) |
| 阻抗控制 |
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+/- 10% |
+/- 7% |
| 板弯曲度 |
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Max. 1.0 % |
Max. 0.5% |
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Red Board Ltd. © 2005. All rights reserved. |
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