Red Board Ltd.

Product Technology

Product Range

	Double-Sided	CEM-3, FR-4, Rogers RO4233, and Bergquist Thermal Clad Laminate 8mil - 120mil (0.2mm - 3.0mm)
	Multilayer	4 - 12 Layers with board thickness of 15mil - 120mil (0.38mm - 3.0mm)
	BVH	4 - 8 Layers with board thickness of 15mil - 62mil (0.38mm - 1.6mm)
	HDI	1+4+1,1+6+1,1+1+4+1+1. RCC or LDP
	Green Products	D/S , M/L (conformed to ROHS requirements)

Product Finishing

Liquid photo-imageable solder mask (LPI)
Peelable solder mask
Conductive Carbon Ink
Hot Air Solder Leveled finish (HASL), with thickness of 80 to 1,000 microinches (2.0-25 micron)
Organic Solderability Preservatives: Entek Cu 106A HT, Preflux F2 LX
Electrolytic Flash Gold with thickness of 0.4 to 3.0 microinches (Au:0.01 to 0.076 micron; Ni:5~15 m m)
Selective Immersion Gold with thickness of 1 to 4 microinches (Au:0.025 to 0.1 micron; Ni:2.54~5.5 m m)
Gold tab/finger plating with thickness of 5 to 30 microinches (Au:0.125 to 0.76 micron; Ni:1.27~12 m m )
Electroless Immersion Tin with thickness of 20 to 48 microinches (0.5 to 1.2 micron)

Design Range

Minimum drilled hole size (mechanical hole)	:	8mil (0.2mm)
Minimum drilled hole size (laser hole)	:	4mil (0.1mm)
Line width/spacing (SMOBC)	:	4mil (100 micron)
Line width/spacing (Flash Gold)	:	3mil (75 micron)
Warpage tolerance	:	0.7% maximum
Maximum Production panel size	:	21.5” x 24.5” (546mm x 622mm)

Dimensional Capability